[News] Micron Creates Dedicated HBM Business Unit, Reportedly Eyes Custom Memory for Big CSPs

As HBM has emerged as a key battle ground for memory giants amid the surging demand for AI, Micron has created a dedicated business unit for HBM. The company says in its press release that the new structure will be in place by early fiscal Q4, starting May 30, 2025, and financial reporting will follow the new format from that quarter onward.

According to Micron, the new organizational structure will consist of four divisions, including Cloud Memory Business Unit (CMBU), Core Data Center Business Unit (CDBU), Mobile & Client Business Unit (MCBU) and Automotive & Embedded Business Unit (AEBU).

As noted by South Korean media outlet etnews, the newly established CMBU, in particular, will focus on memory solutions for hyperscale cloud providers and oversee Micron’s HBM business. This is seen as a strategic move to deliver customized memory to key clients like Microsoft and Amazon Web Services (AWS), the report indicates.

Meanwhile, the etnews report points out that the CDBU will handle OEM server clients such as Dell, HPE, and Gigabyte, since hyperscale customers and OEMs have different requirements.

Micron’s HBM Update

The move seems reasonable, as Micron is eager to shorten its gap with HBM leader SK hynix. As suggested by a previous Sisa Journal report, Micron’s 12-layer HBM3E delivery has started, which powers NVIDIA’s B300.

Notably, The Elec reports that Hanmi Semiconductor, a major thermal compression (TC) bonder supplier, is set to deliver around 50 thermal TC bonders to Micron—far more than the dozens shipped in 2024.

A per TechNews, Micron shows in its AI memory portfolio that its next-generation HBM4 is expected to enter mass production in 2026, followed by HBM4E in subsequent years, in 2027-2028.

Read more

(Photo credit: Micron)